Technology Topics

Spin orbit torque(SOT) driven magnetization switching has recently attracted attention towards next generation magnetic memory. In this report, we newly introduced a canted bias magnetic field and clarified that it makes the SOT driven perpendicular magnetization switching faster and more stable. This was presented at International Conference on Solid State Devices and Materials in 2023(SSDM2023).

We demonstrated a multi-level phase change memory (PCM)/Selector cell which can be programmed without iterative verify operation. Optimal thermal and composition design enabled to form distinct middle resistance state, in which crystalline and amorphous co-exist at designed positions. Multi-level programming was achieved by one single pulse, and it was stable over 10⁷ cycles, making it promising for future cost-effective, large-capacity, and high-speed cross-point memory.

HfO₂-based Ferroelectric Field-Effect Transistor (FeFET) is a promising candidate for next-generation memory. This study clarified that program/erase cycling generated new trap sites in interfacial SiO₂ layer disappears with time. This recovery phenomenon has a non-negligible impact on the threshold voltage behavior during retention process. These results were presented at the international conference SSDM 2023.

Imprint* is one of the critical reliability challenges in HfO₂-FeFET, which has attracted attention as candidates for emerging high-speed memory devices. We have clarified the relationship between spontaneous polarization, trap charge, and imprint by charge component analysis. This result was presented at the international conference SSDM2023.
* Phenomenon in which the voltage required for polarization reversal(coercive voltage V_c) in a ferroelectric film shifts while the polarization state is maintained

We developed a recovery annealing technology applicable to 7-bit per cell flash memory operating at cryogenic temperatures. The technology can contribute to the realization of a sustainable society through future bit cost scaling and extended chip life.

We have successfully demonstrated the preparation of ferromagnetic Co thin layers showing the current-induced domain wall motion (CIDWM), by using atomic layer deposition technique which is widely utilized in the three-dimensional LSI technologies. CIDWM is the key physical phenomenon for race-track memory^[1]. This result was presented in the international conference, IEEE INTERMAG 2023^[2].

We developed new analysis method which can evaluate trap characteristics in short time domain. And we clarified whole picture of hole trapping in SiN film which is essential to improve charge trap memory devices. These results were presented at the international conference IRPS 2023.

HfO₂-based FeFET is a promising candidate for next-generation memory. The coupling between polarization reversal and charge trapping was revealed in this study. We demonstrated a novel operation scheme that strongly suppresses unintended programing of FeFET during memory array operation. These results were presented at the international conference IRPS 2023.

Ferroelectric MOS transistors using HfO₂ as the dielectric and Si as the current path have been widely researched and developed for memory applications including AI applications. Kioxia has fabricated a prototype ferroelectric Field Effect Transistor (FET) using TiO₂ as the current path and demonstrated high-speed, low-voltage operation and high cycle endurance. This achievement received the Best Contributed Paper Award at the international conference EDTM2023.

Selector devices are key components for next-generation high-density memory cell arrays. In this work, the reliability of selector devices has been studied in collaboration with imec, the world-leading R&D center in electronics technologies. The mechanism of the cycling-dependent threshold voltage instability has been clarified by combining electrical characterization and modeling techniques. These results were presented at the international conference IEDM2022.

As the demand for larger memory capacities has rapidly increased, a high etch rate for a high aspect ratio structure is significantly required for high productivity. We have modeled ion-induce surface reactions and developed a simulation technique for predicting the optimal ion species for the etching process of the memory hole because ion species play a dominant role in high aspect ratio etching.

In 3D LSI, transistors are formed on polysilicon. The formation of defect-free polysilicon is important for high performance transistors. To establish the formation process, we improved the conventional electron microscope technology and observed the growth process of crystal grains on an atomic scale in real time.

Large program/erase window, tight Vth distributions and superior data retention characteristics, which were essential to achieve multiple bits per cell, realized by optimizing read operation and FG structures in split-gate cells.

We successfully demonstrated the world’s first 7-bit per cell by combining 77K cryogenic operation with silicon process technology that can improve memory cell characteristics.

HfO₂-FeFETs is a strong candidate for next-generation memory. In HfO₂-FeFETs memory the difference between "0" and "1" decreases after repeated write and erase operations. This cycle degradation, which remained largely unknown, has been clarified by high-speed charge center analysis. This achievement is expected to advance the practical application of HfO₂-FeFET memory. These results were presented at the international conference IEDM2021.

With the growth of the quantum computing and high performance computing, there are increasing demands for the computer systems and electrical components that can operate at relatively low temperature. It has been reported that the characteristics of several types of semiconductor devices can be improved by cryogenic temperature. This report is the first to introduce a cryogenic operation and characteristics of 3D Flash memory at 77 K immerged in the liquid nitrogen.

OS-FET with both high thermal stability and high on-current can be realized by optimizing F amount in IGZO:F. These results are fundamental technologies to realize new memory devices with large amounts of storage, low latency, and ultralow-power consumption, which cannot be achieved by silicon-based FETs.

Recently, ferroelectric memories using ferroelectric-HfO₂ film have attracted much attention towards low-power and high-density in-memory computing for AI (artificial intelligence).

BiCS FLASH™ can increase its memory density and reduce the product cost by increasing the number of word line (WL) layers. The thyristor structure is one of the promising candidates to obtain a large read current even the number of stacked layers is increased.

A challenge of OS-transistor development is improvement of its thermal stability. By using InGaZnO (IGZO) which is a conventional OS, the OS transistor does not work properly by thermal processes required in manufacturing process of the memory device.
In order to overcome this issue, we have newly proposed InAlZnO (IAZO) as an OS material with high thermal stability.

By applying MILC(Metal-induced Lateral Crystallization) technology to Si film in the vertical memory holes, we successfully fabricated the formation of monocrystalline Si from amorphous Si via nickel silicide.
The 3D flash memory cell devices equipped with this technology demonstrated superior electrical characteristics and reduced variation compared to conventional devices using poly-Si as the channel.

Three-dimensional (3D) semicircular split-gate flash memory cells have been successfully developed for the first time.

The challenge for achieving terabit-scale cross-point memory is to reduce operation current of a memory cell.
As a solution, we focused on a new non-volatile memory; Ag ionic memory.

We have established a brand-new evaluation method for nanomaterials by applying the state-of-the-art semiconductor fabrication process.

Memory devices that require new materials and complex 3D structures.

We propose new memory cell technologies to realize even higher bit density file memories, as well as various high-speed nonvolatile memories.