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UFS & e-MMC for Automotive
Paving the Road Ahead for the Automotive Applications of the Future
KIOXIA offers a broad density lineup of high-speed UFS and e-MMC memory for automotive applications, and is well positioned to support data storage demands of increasingly complex automotive applications. KIOXIA automotive UFS and e-MMC support a temperature range of -40°C to +105°C, meets AEC-Q100 Grade 2(8) requirements and offers extended reliability required by demanding automotive applications.
Automotive Functions Require Flash Storage
Next-gen automotive systems are hungry for more. More advanced infotainment and ADAS (advanced driver-assistance system). More storage for event data recording. Support for more 3D mapping. And hungry for entirely new applications and capabilities that take advantage of 5G, IoT and artificial intelligence.
Requirements of Automotive UFS & e-MMC
- Compliant with IATF16949
- Meets automotive standards (e.g., AEC-Q100 Stress Test Qual Standard)
- Supports PPAP (to ensure consistent production of quality parts)
- Extended Temperature Range (e.g., -40°C to +105°C)
- Low Failure Rate
- Extended Product Change Notices (PCNs)
- Features for automotive (e.g., enhanced solder ball reliability, countermeasures if chip exceeds certain temp, etc.)
Automotive UFS(6)
Available capacities: 32GB, 64GB, 128GB, 256GB and 512GB.
Automotive e-MMC(7)
The Changing Interface from e-MMC (parallel) to UFS (serial)
UFS was specifically defined by JEDEC to be the high-performance memory replacement for e-MMC. It has become the premiere solution for smartphones, continuing to migrate into automotive and other applications. UFS will ultimately surpass e-MMC as the primary storage solution for automotive applications.
UFS Market Trend
UFS is the faster performance JEDEC standard replacement to e-MMC. Smartphone adopted UFS for its performance advantages. Automotive is doing the same.
Why UFS?
Simply put – it’s the successor to e-MMC. UFS performance will continue to advance, significantly widening its performance advantage over e-MMC.
Compared to e-MMC, UFS Delivers:
- A faster interface
- Higher performance for reads and writes
- Higher density offerings
- Better power efficiency
- Support for full duplexing
Boot Time Comparison (64MB Data-out)
Faster boot time with a large amount of boot data is a big motivation to use UFS in automotive applications.
UFS has a faster boot time than other storage devices thanks to its high speed sequential read.
Additional Automotive UFS Features Well-Suited for Automotive Reliability
- Thermal Control: If the device exceeds 105°C, the device slows the performance and notifies the host processor to take action
- Extended Diagnosis: the UFS controller monitors various items, such as write/erase cycles, current temperature, etc. and reports device status to the host processor
- Refresh: enables refresh of deteriorated data, improving data reliability.
KIOXIA has led the way in UFS since 2013, being first to sample the technology,
and will continue to pave the road ahead for automotive applications of the future.
Learn and Evaluate
Automotive UFS Specs
AEC-Q100 Grade 2
*Table can be scrolled horizontally.
| Capacity | Part Number | UFS version |
Max Data Rate (MB/s) |
Supply Voltage | Operating Temperature (℃) (1) |
Package Size (mm) |
||
|---|---|---|---|---|---|---|---|---|
| VCC (V) |
VCCQ (V) |
VCCQ2 (V) |
||||||
| 32GB | THGAFBG8T13BAB7(3) | 2.1 | 1160 | 2.7 to 3.6 | - (4) | 1.70 to 1.95 | -40 to 105 | 11.5x13.0x1.0 |
| THGAFEG8T13BAB7 | ||||||||
| 64GB | THGAFBG9T23BAB8(3) | 11.5x13.0x1.2 | ||||||
| THGAFEG9T23BAB8 | ||||||||
| 128GB | THGAFBT0T43BAB8(3) | |||||||
| THGAFET0T43BAB8 | ||||||||
| 256GB | THGAFBT1T83BAB5(3) | 11.5x13.0x1.3 | ||||||
| THGAFET1T83BAB5 | ||||||||
| 64GB | THGJFGG9T15BAB8 | 3.1 | 2320 | 2.4 to 2.7, 2.7 to 3.6 |
1.14 to 1.26 | - (5) | -40 to 105 | 11.5x13.0x1.2 |
| 128GB | THGJFGT0T25BAB8 | |||||||
| 256GB | THGJFGT1T45BAB8 | |||||||
| 512GB | THGJFGT2T85BAB5 | 11.5x13.0x1.3 | ||||||
AEC-Q100 Grade 3
*Table can be scrolled horizontally.
| Capacity | Part Number | UFS version |
Max Data Rate (MB/s) |
Supply Voltage | Operating Temperature (℃) (2) |
Package Size (mm) |
||
|---|---|---|---|---|---|---|---|---|
| VCC (V) |
VCCQ (V) |
VCCQ2 (V) |
||||||
| 64GB | THGJFGG9T15BAA8 | 3.1 | 2320 | 2.4 to 2.7, 2.7 to 3.6 |
1.14 to 1.26 | - (5) | -40 to 85 | 11.5x13.0x1.2 |
| 128GB | THGJFGT0T25BAA8 | |||||||
| 256GB | THGJFGT1T45BAA8 | |||||||
| 512GB | THGJFGT2T85BAA5 | 11.5x13.0x1.3 | ||||||
Automotive e-MMC Specs
AEC-Q100 Grade2
*Table can be scrolled horizontally.
| Capacity | Part Number | e-MMC version |
Max Data Rate (MB/s) |
Supply Voltage | Operating Temperature (℃) (1) |
Package Size (mm) |
|
|---|---|---|---|---|---|---|---|
| VCC (V) |
VCCQ (V) |
||||||
| 8GB | THGBMJG6C1LBAC7 | 5.1 | 400 | 2.7 to 3.6 | 1.70 to 1.95, 2.7 to 3.6 |
-40 to 105 | 11.5x13.0x1.0 |
| 16GB | THGBMJG7C2LBAC8 | 11.5x13.0x1.2 | |||||
| 32GB | THGBMJG8C4LBAC8 | ||||||
| 64GB | THGBMJG9C8LBAC8 | ||||||
| 32GB | THGAMVG8T13BAB7 | 1.70 to 1.95 | 11.5x13.0x1.0 | ||||
| 64GB | THGAMVG9T23BAB8 | 11.5x13.0x1.2 | |||||
| 128GB | THGAMVT0T43BAB8 | ||||||
| 256GB | THGAMVT1T83BAB5 | 11.5x13.0x1.3 | |||||
AEC-Q100 Grade3
*Table can be scrolled horizontally.
| Capacity | Part Number | e-MMC version |
Max Data Rate (MB/s) |
Supply Voltage | Operating Temperature (℃) |
Package Size (mm) |
|
|---|---|---|---|---|---|---|---|
| VCC (V) |
VCCQ (V) |
||||||
| 32GB | THGAMVG8T13BAA7 | 5.1 | 400 | 2.7 to 3.6 | 1.70 to 1.95 | -40 to 85 | 11.5x13.0x1.0 |
| 64GB | THGAMVG9T23BAA8 | 11.5x13.0x1.2 | |||||
| 128GB | THGAMVT0T43BAA8 | ||||||
| 256GB | THGAMVT1T83BAA5 | 11.5x13.0x1.3 | |||||
- Tc=115℃ max.
- Tc=95℃ max.
- Maximum pre-load capacity is limited to about 25% of the user area capacity.
- This product supports dual-supply operation at VCC and VCCQ2. VCCQ need not be supplied.
- This product supports dual-supply operation at VCC and VCCQ. VCCQ2 need not be supplied.
- Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification.
- e-MMC is a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification.
- Electrical component qualification requirements defined by the AEC (Automotive Electronics Council).
Support
Please contact us if you have any technical questions, requests for materials, are interested in samples or purchases of business products (Memory, SSD), etc.
In 2007, KIOXIA announced the world‘s first 3D flash memory technology. Presenting our cutting-edge technologies, along with the key points of innovation and our efforts toward further increases in capacity.
KIOXIA invented the world’s first NAND flash memory in 1987. This is an explanation of the structure of flash memory and the mechanism of data storage.
“Multi-level cell technology” is one of the main technologies realizing larger capacity flash memory. The 1 Gbit MLC NAND flash memory launched by KIOXIA in 2001 was the first application in the world of multi-level cell technology to a NAND flash memory product.
