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Technology Topics
Introducing the latest technologies being researched and developed at KIOXIA Corporation and various use cases of flash memories.
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BiCS FLASH™ generation 10 is high memory density 3D flash memory which is well-scaled to 29Gb/mm2 with 332 world-lines stacked and our layout optimization technique, and it achieved the highest bit density and smallest chip in the 1Tb products. We also realized 4.8Gbps data transfer rate and 29% improvement on read energy consumption with new Interface circuit and read operation method.
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We have developed a package that incorporates 3D flash memory and a boost circuit using a DC-DC converter. This technology can drastically reduce power consumption and operating temperatures, enabling the thermal throttling-less SSD even if the number of Word-line stacked layers reaches 1,000 in the future. This achievement was presented at the International Memory Workshop 2023.
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We investigated the adhesion mechanism between the mold resin and sputtered copper in electromagnetic wave shield packages. We found that the amount of silica filler exposed by etching the mold resin affects the adhesion with copper.
R&D Organization
We aim to pursue continuous technological exploration and its social implementation to achieve an affluent and sustainable digitalized society through innovative memory technologies.
Conducts R&D on BiCS FLASH™, a type of 3D flash memory that KIOXIA was the first to develop in the world, while serving as a bridge between R&D and volume production.
KIOXIA memory and storage solutions enable the success of emerging applications and allow existing technologies to reach their expected potential.
A technical glossary that covers terms related to KIOXIA products and technologies, such as memory and SSDs. We explain that it can be used by engineers and researchers to the general public.
KIOXIA has established industry-leading R&D frameworks with “memory” technology. We use our various locations to conduct technological innovation while promoting open innovation.
