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Technology Topics
Introducing the latest technologies being researched and developed at KIOXIA Corporation and various use cases of flash memories.
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We investigated the adhesion mechanism between the mold resin and sputtered copper in electromagnetic wave shield packages. We found that the amount of silica filler exposed by etching the mold resin affects the adhesion with copper.
R&D Organization

Conducts advanced research and development, application system development, and development prototyping in the field of memory including emerging memory

Conducts R&D on BiCS FLASH™, a type of 3D flash memory that KIOXIA was the first to develop in the world, while serving as a bridge between R&D and volume production.