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EDSFF E3 Form Factor
E3 - Enterprise Servers and Storage
| Type | Thickness (mm) | Width (mm) | Length (mm) | Max Power (W) |
|---|---|---|---|---|
| E3.S | 7.5 | 76 | 112.75 | 25 |
| E3.S 2T | 16.8 | 40 | ||
| E3.L | 7.5 | 142.2 | ||
| E3.L 2T | 16.8 | 70 |
PCIe® Lanes per Connector
E3 Max Power
Engineering Specifications from SNIA
| E3 Mechanical/Electrical Specification | SFF-TA-1008  |
| E3 Thermal Characterization Specification | SFF-TA-1023 |
| EDSFF Connector Specification | SFF-TA-1002 |
| EDSFF Connector Pinout (PCIe) | SFF-TA-1009 |
KIOXIA EDSFF E3 Offerings
KIOXIA CD8P Series
KIOXIA CD7 Series
KIOXIA CM7 Series
| KIOXIA SSD Series | Form Factor | Endurance | Interface | Storage Capacity (GB) |
Sequential Read/Write (MB/s) |
Random Read/Write (IOPS) |
|---|---|---|---|---|---|---|
| EDSFF E3.S | Mixed Use (3 DWPD for 5 years) |
PCIe® Gen5 x4, NVMe™ 2.0 | 1,600 3,200 6,400 12,800 |
Up to 12,000 / 5,500 |
Up to 2,000K / 400K |
|
| Read Intensive (1 DWPD for 5 years) |
1,920 3,840 7,680 15,360 |
Up to 2,000K / 200K |
||||
| Read Intensive (1 DWPD for 5 years) |
Designed to PCIe® Gen5 x4, NVMe™ 1.4 |
1,920 3,840 7,680 |
Up to 6,450 / 5,600 |
Up to 1,050K / 180K |
||
| Mixed Use (3 DWPD for 5 years) |
PCIe® Gen5 single x4, dual x2, NVMe™ 2.0 |
1,600 3,200 6,400 12,800 |
Up to 14,000 / 7,000 |
Up to 2,700K / 600K |
||
| Read Intensive (1 DWPD for 5 years) |
1,920 3,840 7,680 15,360 |
Up to 2,700K / 310K |
Companies Offering EDSFF E3.S-enabled Platforms
While E3 form factors began with a focus on traditional enterprise server and storage use cases, hyperscalers are evaluating E3 for use in scale-out environments. Many server, storage and SSD companies with 2.5-inch storage solutions are aligned with the E3 Family. Initial development and demonstration systems in support of the E3 Family of form factors are well underway with early full function development vehicles as shown (Figure 1).
Figure 1: EDSFF prototype with KIOXIA E3.S Prototype NVMe SSDs
Learn and Evaluate
Press Releases
- Product image may represent a design model.
- PCIe is a registered trademark of PCI-SIG.
- NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
- Other company names, product names, and service names may be trademarks of third-party companies.
- All rights reserved. Information, including product specifications, content of services, and contact information is believed to be accurate as of October, 2023, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications.
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KIOXIA has developed many “world-first” technologies, such as NAND flash memory and created innovation. As a leading company in “memory,” KIOXIA will continue to work on cutting-edge research and development to create innovation.