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EDSFF - A New SSD Form Factor for Next Gen Servers and Storage
The Future of Enterprise and Data Center Storage is EDSFF
EDSFF stands for Enterprise and Datacenter Standard Form Factor. The initial version of the EDSFF specification was created by SNIA SFF Technology Affiliate organization to address the concerns of data center storage. Today, the dominant form factors are 2.5-inch and M.2 for SSDs. EDSFF aims to address the issues and limitations enterprise and data center users face with legacy form factors by designing a new specification meant for NAND flash memory and other devices. The benefits include, but aren’t limited to, better signal integrity and the ability to deliver more power to an SSD for superior performance.
The Benefits of EDSFF
EDSFF connector design is compliant to the same connector standard specification across all EDSFF configurations, and it can be used without limitation on the number of lanes and is flexible to chassis and backplane designs.
EDSFF is design to support higher power up to 70W*, delivering superior performance, while 2.5-inch SSDs using the SFF-8639 connector typically max out at 25W.
* The design value of maximum power depends on the device.
EDSFF can support up to 4x higher performance in a 4C configuration with 16 lanes and 2x higher performance in a 2C configuration with 8 lanes than a 4 lane 2.5-inch SSD (U.2 or U.3). *
* The number of lanes depends on the device. As of March 2023, KIOXIA does not support SSDs beyond PCIe® x4 lanes.
The EDSFF is designed with efficient use of space and surface area, improving thermal dissipation and allowing for higher density chassis.
EDSFF is designed to support other PCIe® devices, such as NICs or accelerators, that can be used in the same chassis not limited to SSDs.
Which EDSFF Is Right for Me?
- E3 SSDs can utilize up to 16 PCIe® lanes with power profiles up to 70W *
- E3 SSDs utilize the robust EDSFF connector, allowing for high data rates
- E3.L 2T form factor enables approximately 2x higher capacity compared to 2.5-inch form factor **
* As of March 2023, KIOXIA does not support SSDs beyond PCIe® x4 lanes.
** Estimate by KIOXIA.
|KIOXIA XD7P Series||KIOXIA XD6 Series||KIOXIA CD8P Series||KIOXIA CD7 Series||KIOXIA CM7 Series|
|Use Cases||High density server
|High performance server||Storage arrays
High performance server
|Endurance||Read Intensive (1 DWPD for 5 years)||Read Intensive (1 DWPD for 5 years)
Mixed Use (3 DWPD for 5 years)
|Read Intensive (1 DWPD for 5 years)||Read Intensive (1 DWPD for 5 years)
Mixed Use (3 DWPD for 5 years)
|Interface||PCIe® Gen4 x4, NVMe™ 2.0||PCIe® Gen4 x4, NVMe™ 1.3c||PCIe® Gen5 x4, NVMe™ 2.0||Designed to PCIe® Gen5 x4, NVMe™ 1.4||PCIe® Gen5 single x4, dual x2, NVMe™ 2.0|
|Storage Capacity (GB)||1,920 / 3,840 / 7,680||1,920 / 3,840||1,600 / 1,920 / 3,200 / 3,840 / 6,400 / 7,680 / 12,800 / 15,360||1,920 / 3,840 / 7,680||1,600 / 1,920 / 3,200 / 3,840 / 6,400 / 7,680 / 12,800 / 15,360|
|Security Options||SED||SIE, SED||SIE||SIE, SED, FIPS|
EDSFF Architecture Requirements
Taking into account ‘what’s needed’ for a new form factor architecture given 2.5-inch and M.2 drive limitations, the resulting architecture needs to be a balance of these requirements to achieve an optimal design:
- Product image may represent a design model.
- PCIe is a registered trademark of PCI-SIG.
- NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
- Other company names, product names, and service names may be trademarks of third-party companies.
- All rights reserved. Information, including product specifications, content of services, and contact information is believed to be accurate as of October, 2023, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable KIOXIA product specifications.