KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show’ at FMS: the Future of Memory and Storage 2025

  • August 6, 2025
  • Kioxia Corporation

Tokyo – Kioxia Corporation today announced that its KIOXIA LC9 Series 245.76 terabyte (TB)(1) enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC 3D flash memory, has received the FMS ‘Best of Show’ award in the ‘SSD Technology’ category. These awards recognize the cutting-edge products, services, and customer implementations that are pushing the boundaries of memory and storage technology.

The industry’s first(2) 245.76 TB(1) NVMe™ SSD in a 2.5-inch and Enterprise and Datacenter Standard Form Factor (EDSFF) E3.L form factor, KIOXIA LC9 Series drives are well-suited to generative AI and enterprise applications. KIOXIA LC9 Series SSDs are now sampling to select customers.

“When customers evaluate SSDs, important consideration is given to storage that scales to high capacities while delivering high performance and low power consumption,” said Jay Kramer, Chair of the Awards Program and President of Network Storage Advisors Inc. “We are proud to recognize KIOXIA for its BiCS FLASH™ 3D flash memory and KIOXIA LC9 Series SSD. This solution is enabled by their CBA (CMOS directly Bonded to Array) technology and the innovation of a 32-die stacked architecture in a package - delivering the capacity, power and density required for transformational SSDs. Creating the highest capacity(2) PCIe® 5.0 enterprise SSD is a remarkable achievement and a clear reflection of Kioxia’s leadership position.”

Featuring a 32-die stack of 2 terabit (Tb)(3) BiCS FLASH™ QLC 3D flash memory with innovative CBA technology, KIOXIA LC9 Series SSDs deliver the speed, scale, and density required to support the next wave of AI-centric workloads. This combination of advanced memory architecture and CBA technology enables 8 TB(3) in a small 154 BGA package –also an industry first(2). This milestone was made possible with advancements in Kioxia’s high-precision wafer processing, material design, and wire bonding technologies.

KIOXIA LC9 Series 245.76 TB Enterprise SSD with Innovative 32-die Stack Memory Named ‘Best of Show’ at FMS 2025

Notes:

  1. Definition of SSD capacity: Kioxia Corporation defines a kilobyte (KB) as 1,000 bytes, a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes, a terabyte (TB) as 1,000,000,000,000 bytes, and a kibibyte (KiB) is 1,024 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 bytes = 1,073,741,824 bytes and 1TB = 2^40 bytes = 1,099,511,627,776 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  2. As of August 6, 2025, based on Kioxia survey.
  3. The flash memory capacity is calculated as 1 terabit (1 Tb) = 1,099,511,627,776 (2^40) bits, and 1 terabyte (1 TB) = 1,099,511,627,776 (2^40) bytes.

 

  • 2.5-inch indicates the form factor of the SSD and not its physical size.
  • NVMe is a registered or unregistered trademark of NVM Express, Inc. in the United States and other countries.
  • PCIe is a registered trademark of PCI-SIG.
  • Other company names, product names and service names may be trademarks of third-party companies.

 

About Kioxia

Kioxia is a world leader in memory solutions, dedicated to the development, production and sale of flash memory and solid-state drives (SSDs). In April 2017, its predecessor Toshiba Memory was spun off from Toshiba Corporation, the company that invented NAND flash memory in 1987. Kioxia is committed to uplifting the world with “memory” by offering products, services and systems that create choice for customers and memory-based value for society. Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, automotive systems, data centers and generative AI systems.

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Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.