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Toshiba to Showcase Latest NAND and Storage Products at Flash Memory Summit
- August 5, 2014
- Toshiba Corporation
TOKYO— Toshiba Corporation (TOKYO: 6502) today announced that it will showcase its latest NAND flash and storage products at Flash Memory Summit, the world’s largest flash memory conference, which will be held from August 5 to 7 at the Santa Clara Convention Center in Santa Clara, California, USA.
The exhibition part of Flash Memory Summit will be held in the latter two days, August 6 and 7, and Toshiba will be exhibiting at booth #504.
- Enterprise SSD：
- Client SSD：
- Mobile Memory：
・Embedded Storage Memory Solution: UFS, e-MMC™
・Media Card: SD Memory Card, USB Flash Memory
・Wireless LAN SDHC Memory Card: FlashAir™
- Enterprise & Industrial Memory：
・SLC NAND, BENAND™, 15nm Process NAND Wafer
・Enterprise Read Intensive SSD PX03SN/HK3R Series
・High Read IOPS Server Demonstration of the PX03SN Series
・High-End Client SSD HG6 Series
・TLC NAND Embedded Client SSD SG4 Series (Reference Exhibit)
: TLC: Triple Level Cell (Storage type of NAND flash storing data of 3-bit-per-cell)
: UFS: Universal Flash Storage
: SLC: Single Level Cell
: BENAND™: Built-in ECC NAND
- e-MMC is a trademark of JEDEC/MMCA.
- FlashAir™ and BENAND™ are trademarks of Toshiba Corporation.